Actuator coil temperature estimation using skew values

ABSTRACT

A computer program product according to one embodiment includes a computer readable storage medium having program instructions embodied therewith, the program instructions executable by a controller of a data storage device to cause the controller to perform a method including, determining, by the controller, a test skew gain of a coil using skew information from a servo subsystem of the controller; comparing, by the controller, the test skew gain to a stored reference gain for determining whether a temperature of the coil is elevated; and stopping the data storage device, by the controller, in response to the comparing of the test skew gain to the reference gain indicating that the temperature of the coil is elevated.

BACKGROUND

The present invention relates to data storage systems, and moreparticularly, this invention relates to temperature estimation inactuator mechanisms, e.g., in data storage systems such as tape drives,and use thereof, e.g., for thermal stress prevention.

In magnetic storage systems, magnetic transducers read data from andwrite data onto magnetic recording media. Data is written on themagnetic recording media by moving a magnetic recording transducer to aposition over the media where the data is to be stored. The magneticrecording transducer then generates a magnetic field, which encodes thedata into the magnetic media. Data is read from the media by similarlypositioning the magnetic read transducer and then sensing the magneticfield of the magnetic media. Read and write operations may beindependently synchronized with the movement of the media to ensure thatthe data can be read from and written to the desired location on themedia.

An important and continuing goal in the data storage industry is that ofincreasing the density of data stored on a medium. For tape storagesystems, that goal has led to increasing the track and linear bitdensity on recording tape, and decreasing the thickness of the magnetictape medium. However, the development of small footprint, higherperformance tape drive systems has created various problems in thedesign of a tape head assembly for use in such systems.

In a tape drive system, the drive moves the magnetic tape over thesurface of the tape head at high speed. Usually the tape head isdesigned to minimize the spacing between the head and the tape. Thespacing between the magnetic head and the magnetic tape is crucial andso goals in these systems are to have the recording gaps of thetransducers, which are the source of the magnetic recording flux in nearcontact with the tape to effect writing sharp transitions, and to havethe read elements in near contact with the tape to provide effectivecoupling of the magnetic field from the tape to the read elements.

SUMMARY

A computer program product according to one embodiment includes acomputer readable storage medium having program instructions embodiedtherewith, the program instructions executable by a controller of a datastorage device to cause the controller to perform a method including,determining, by the controller, a test skew gain of a coil using skewinformation from a servo subsystem of the controller; comparing, by thecontroller, the test skew gain to a stored reference gain fordetermining whether a temperature of the coil is elevated; and stoppingthe data storage device, by the controller, in response to the comparingof the test skew gain to the reference gain indicating that thetemperature of the coil is elevated.

An apparatus according to another embodiment includes a controllerconfigured to determine, by the controller, a test skew gain of a coilusing skew information from a servo subsystem thereof; compare, by thecontroller, the test skew gain to a stored reference gain fordetermining whether a temperature of the coil is elevated; and stop thedata storage device, by the controller, in response to the comparing ofthe test skew gain to the reference gain indicating that the temperatureof the coil is elevated.

A method according to yet another embodiment includes determining a testskew gain of a coil in a data storage device using skew information froma servo subsystem of a controller, comparing the test skew gain to astored reference gain, and taking an action in response to the comparingof the test skew gain to the reference gain.

Any of these embodiments may be implemented in a magnetic data storagesystem such as a tape drive system, which may include a magnetic head, adrive mechanism for passing a magnetic medium (e.g., recording tape)over the magnetic head, and a controller electrically coupled to themagnetic head.

Other aspects and embodiments of the present invention will becomeapparent from the following detailed description, which, when taken inconjunction with the drawings, illustrate by way of example theprinciples of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a schematic diagram of a simplified tape drive systemaccording to one embodiment.

FIG. 1B is a schematic diagram of a tape cartridge according to oneembodiment.

FIG. 2 illustrates a side view of a flat-lapped, bi-directional,two-module magnetic tape head according to one embodiment.

FIG. 2A is a tape bearing surface view taken from Line 2A of FIG. 2.

FIG. 2B is a detailed view taken from Circle 2B of FIG. 2A.

FIG. 2C is a detailed view of a partial tape bearing surface of a pairof modules.

FIG. 3 is a partial tape bearing surface view of a magnetic head havinga write-read-write configuration.

FIG. 4 is a partial tape bearing surface view of a magnetic head havinga read-write-read configuration.

FIG. 5 is a side view of a magnetic tape head with three modulesaccording to one embodiment where the modules all generally lie alongabout parallel planes.

FIG. 6 is a side view of a magnetic tape head with three modules in atangent (angled) configuration.

FIG. 7 is a side view of a magnetic tape head with three modules in anoverwrap configuration.

FIG. 8A is an exploded partial perspective view of an apparatusaccording to one embodiment.

FIG. 8B is a side view of the apparatus from FIG. 8A taken along line8B-8B of FIG. 8A.

FIG. 8C is a top-down view of the apparatus from FIG. 8A taken alongline 8C-8C of FIG. 8A.

FIG. 9 is a graph depicting the comparative coil temperature vs. currentfor the apparatus according to one embodiment.

FIG. 10 is a graph depicting the comparative coil temperature vs. coilresistance for the apparatus according to one embodiment.

FIG. 11 is a graph depicting the comparative average skew digitalizedamps current (DAC) output vs. commanded skew reference for the apparatusaccording to one embodiment.

FIG. 12 is a flowchart of a method according to one embodiment.

FIG. 13 is a graph depicting the comparative average skew DAC output vs.commanded skew reference for the apparatus according to one embodiment.

DETAILED DESCRIPTION

The following description is made for the purpose of illustrating thegeneral principles of the present invention and is not meant to limitthe inventive concepts claimed herein. Further, particular featuresdescribed herein can be used in combination with other describedfeatures in each of the various possible combinations and permutations.

Unless otherwise specifically defined herein, all terms are to be giventheir broadest possible interpretation including meanings implied fromthe specification as well as meanings understood by those skilled in theart and/or as defined in dictionaries, treatises, etc.

It must also be noted that, as used in the specification and theappended claims, the singular forms “a,” “an” and “the” include pluralreferents unless otherwise specified.

The following description discloses several preferred embodiments ofdata storage systems, as well as operation and/or component partsthereof.

In one general embodiment, a computer program product includes acomputer readable storage medium having program instructions embodiedtherewith, the program instructions executable by a controller of a datastorage device to cause the controller to perform a method including,determining, by the controller, a test skew gain of a coil using skewinformation from a servo subsystem of the controller; comparing, by thecontroller, the test skew gain to a stored reference gain; and taking anaction, by the controller, in response to the comparing of the test skewgain to the reference gain.

In another general embodiment, an apparatus includes a controllerconfigured to determine, by the controller, a test skew gain of a coilusing skew information from a servo subsystem thereof; compare, by thecontroller, the test skew gain to a stored reference gain; and take anaction, by the controller, in response to the comparing of the test skewgain to the reference gain.

In yet another general embodiment, an apparatus includes determining atest skew gain of a coil in a data storage device using skew informationfrom a servo subsystem of a controller, comparing the test skew gain toa stored reference gain for determining whether a temperature of thecoil is elevated, and stopping the data storage device in response tothe comparing of the test skew gain to the reference gain indicatingthat the temperature of the coil is elevated.

FIG. 1A illustrates a simplified tape drive 100 of a tape-based datastorage system, which may be employed in the context of the presentinvention. While one specific implementation of a tape drive is shown inFIG. 1A, it should be noted that the embodiments described herein may beimplemented in the context of any type of tape drive system.

As shown, a tape supply cartridge 120 and a take-up reel 121 areprovided to support a tape 122. One or more of the reels may form partof a removable cartridge and are not necessarily part of the system 100.The tape drive, such as that illustrated in FIG. 1A, may further includedrive motor(s) to drive the tape supply cartridge 120 and the take-upreel 121 to move the tape 122 over a tape head 126 of any type. Suchhead may include an array of readers, writers, or both.

Guides 125 guide the tape 122 across the tape head 126. Such tape head126 is in turn coupled to a controller 128 via a cable 130. Thecontroller 128, may be or include a processor and/or any logic forcontrolling any subsystem of the drive 100. For example, the controller128 typically controls head functions such as servo following, datawriting, data reading, etc. The controller 128 may include at least oneservo channel and at least one data channel, each of which include dataflow processing logic configured to process and/or store information tobe written to and/or read from the tape 122. The controller 128 mayoperate under logic known in the art, as well as any logic disclosedherein, and thus may be considered as a processor for any of thedescriptions of tape drives included herein, in various embodiments. Thecontroller 128 may be coupled to a memory 136 of any known type, whichmay store instructions executable by the controller 128. Moreover, thecontroller 128 may be configured and/or programmable to perform orcontrol some or all of the methodology presented herein. Thus, thecontroller 128 may be considered to be configured to perform variousoperations by way of logic programmed into one or more chips, modules,and/or blocks; software, firmware, and/or other instructions beingavailable to one or more processors; etc., and combinations thereof.

The cable 130 may include read/write circuits to transmit data to thehead 126 to be recorded on the tape 122 and to receive data read by thehead 126 from the tape 122. An actuator 132 controls position of thehead 126 relative to the tape 122.

An interface 134 may also be provided for communication between the tapedrive 100 and a host (internal or external) to send and receive the dataand for controlling the operation of the tape drive 100 andcommunicating the status of the tape drive 100 to the host, all as willbe understood by those of skill in the art.

FIG. 1B illustrates an exemplary tape cartridge 150 according to oneembodiment. Such tape cartridge 150 may be used with a system such asthat shown in FIG. 1A. As shown, the tape cartridge 150 includes ahousing 152, a tape 122 in the housing 152, and a nonvolatile memory 156coupled to the housing 152. In some approaches, the nonvolatile memory156 may be embedded inside the housing 152, as shown in FIG. 1B. In moreapproaches, the nonvolatile memory 156 may be attached to the inside oroutside of the housing 152 without modification of the housing 152. Forexample, the nonvolatile memory may be embedded in a self-adhesive label154. In one preferred embodiment, the nonvolatile memory 156 may be aFlash memory device, ROM device, etc., embedded into or coupled to theinside or outside of the tape cartridge 150. The nonvolatile memory isaccessible by the tape drive and the tape operating software (the driversoftware), and/or other device.

By way of example, FIG. 2 illustrates a side view of a flat-lapped,bi-directional, two-module magnetic tape head 200 which may beimplemented in the context of the present invention. As shown, the headincludes a pair of bases 202, each equipped with a module 204, and fixedat a small angle α with respect to each other. The bases may be“U-beams” that are adhesively coupled together. Each module 204 includesa substrate 204A and a closure 204B with a thin film portion, commonlyreferred to as a “gap” in which the readers and/or writers 206 areformed. In use, a tape 208 is moved over the modules 204 along a media(tape) bearing surface 209 in the manner shown for reading and writingdata on the tape 208 using the readers and writers. The wrap angle θ ofthe tape 208 at edges going onto and exiting the flat media supportsurfaces 209 are usually between about 0.1 degree and about 3 degrees.

The substrates 204A are typically constructed of a wear resistantmaterial, such as a ceramic. The closures 204B may be made of the sameor similar ceramic as the substrates 204A.

The readers and writers may be arranged in a piggyback or mergedconfiguration. An illustrative piggybacked configuration comprises a(magnetically inductive) writer transducer on top of (or below) a(magnetically shielded) reader transducer (e.g., a magnetoresistivereader, etc.), wherein the poles of the writer and the shields of thereader are generally separated. An illustrative merged configurationcomprises one reader shield in the same physical layer as one writerpole (hence, “merged”). The readers and writers may also be arranged inan interleaved configuration. Alternatively, each array of channels maybe readers or writers only. Any of these arrays may contain one or moreservo track readers for reading servo data on the medium.

FIG. 2A illustrates the tape bearing surface 209 of one of the modules204 taken from Line 2A of FIG. 2. A representative tape 208 is shown indashed lines. The module 204 is preferably long enough to be able tosupport the tape as the head steps between data bands.

In this example, the tape 208 includes 4 to 32 data bands, e.g., with 16data bands and 17 servo tracks 210, as shown in FIG. 2A on a one-halfinch wide tape 208. The data bands are defined between servo tracks 210.Each data band may include a number of data tracks, for example 1024data tracks (not shown). During read/write operations, the readersand/or writers 206 are positioned to specific track positions within oneof the data bands. Outer readers, sometimes called servo readers, readthe servo tracks 210. The servo signals are in turn used to keep thereaders and/or writers 206 aligned with a particular set of tracksduring the read/write operations.

FIG. 2B depicts a plurality of readers and/or writers 206 formed in agap 218 on the module 204 in Circle 2B of FIG. 2A. As shown, the arrayof readers and writers 206 includes, for example, 16 writers 214, 16readers 216 and two servo readers 212, though the number of elements mayvary. Illustrative embodiments include 8, 16, 32, 40, and 64 activereaders and/or writers 206 per array, and alternatively interleaveddesigns having odd numbers of reader or writers such as 17, 25, 33, etc.An illustrative embodiment includes 32 readers per array and/or 32writers per array, where the actual number of transducer elements couldbe greater, e.g., 33, 34, etc. This allows the tape to travel moreslowly, thereby reducing speed-induced tracking and mechanicaldifficulties and/or execute fewer “wraps” to fill or read the tape.While the readers and writers may be arranged in a piggybackconfiguration as shown in FIG. 2B, the readers 216 and writers 214 mayalso be arranged in an interleaved configuration. Alternatively, eacharray of readers and/or writers 206 may be readers or writers only, andthe arrays may contain one or more servo readers 212. As noted byconsidering FIGS. 2 and 2A-B together, each module 204 may include acomplementary set of readers and/or writers 206 for such things asbi-directional reading and writing, read-while-write capability,backward compatibility, etc.

FIG. 2C shows a partial tape bearing surface view of complementarymodules of a magnetic tape head 200 according to one embodiment. In thisembodiment, each module has a plurality of read/write (R/W) pairs in apiggyback configuration formed on a common substrate 204A and anoptional electrically insulative layer 236. The writers, exemplified bythe write transducer 214 and the readers, exemplified by the readtransducer 216, are aligned parallel to an intended direction of travelof a tape medium thereacross to form an R/W pair, exemplified by the R/Wpair 222. Note that the intended direction of tape travel is sometimesreferred to herein as the direction of tape travel, and such terms maybe used interchangeably. Such direction of tape travel may be inferredfrom the design of the system, e.g., by examining the guides; observingthe actual direction of tape travel relative to the reference point;etc. Moreover, in a system operable for bi-direction reading and/orwriting, the direction of tape travel in both directions is typicallyparallel and thus both directions may be considered equivalent to eachother.

Several R/W pairs 222 may be present, such as 8, 16, 32 pairs, etc. TheR/W pairs 222 as shown are linearly aligned in a direction generallyperpendicular to a direction of tape travel thereacross. However, thepairs may also be aligned diagonally, etc. Servo readers 212 arepositioned on the outside of the array of R/W pairs, the function ofwhich is well known.

Generally, the magnetic tape medium moves in either a forward or reversedirection as indicated by arrow 220. The magnetic tape medium and headassembly 200 operate in a transducing relationship in the mannerwell-known in the art. The piggybacked MR head assembly 200 includes twothin-film modules 224 and 226 of generally identical construction.

Modules 224 and 226 are joined together with a space present betweenclosures 204B thereof (partially shown) to form a single physical unitto provide read-while-write capability by activating the writer of theleading module and reader of the trailing module aligned with the writerof the leading module parallel to the direction of tape travel relativethereto. When a module 224, 226 of a piggyback head 200 is constructed,layers are formed in the gap 218 created above an electricallyconductive substrate 204A (partially shown), e.g., of AlTiC, ingenerally the following order for the R/W pairs 222: an insulating layer236, a first shield 232 typically of an iron alloy such as NiFe (—),cobalt zirconium tantalum (CZT) or Al—Fe—Si (Sendust), a sensor 234 forsensing a data track on a magnetic medium, a second shield 238 typicallyof a nickel-iron alloy (e.g., ˜80/20 at % NiFe, also known aspermalloy), first and second writer pole tips 228, 230, and a coil (notshown). The sensor may be of any known type, including those based onMR, GMR, AMR, tunneling magnetoresistance (TMR), etc.

The first and second writer poles 228, 230 may be fabricated from highmagnetic moment materials such as ˜45/55 NiFe. Note that these materialsare provided by way of example only, and other materials may be used.Additional layers such as insulation between the shields and/or poletips and an insulation layer surrounding the sensor may be present.Illustrative materials for the insulation include alumina and otheroxides, insulative polymers, etc.

The configuration of the tape head 126 according to one embodimentincludes multiple modules, preferably three or more. In awrite-read-write (W-R-W) head, outer modules for writing flank one ormore inner modules for reading. Referring to FIG. 3, depicting a W-R-Wconfiguration, the outer modules 252, 256 each include one or morearrays of writers 260. The inner module 254 of FIG. 3 includes one ormore arrays of readers 258 in a similar configuration. Variations of amulti-module head include a R-W-R head (FIG. 4), a R-R-W head, a W-W-Rhead, etc. In yet other variations, one or more of the modules may haveread/write pairs of transducers. Moreover, more than three modules maybe present. In further approaches, two outer modules may flank two ormore inner modules, e.g., in a W-R-R-W, a R-W-W-R arrangement, etc. Forsimplicity, a W-R-W head is used primarily herein to exemplifyembodiments of the present invention. One skilled in the art apprisedwith the teachings herein will appreciate how permutations of thepresent invention would apply to configurations other than a W-R-Wconfiguration.

FIG. 5 illustrates a magnetic head 126 according to one embodiment ofthe present invention that includes first, second and third modules 302,304, 306 each having a tape bearing surface 308, 310, 312 respectively,which may be flat, contoured, etc. Note that while the term “tapebearing surface” appears to imply that the surface facing the tape 315is in physical contact with the tape bearing surface, this is notnecessarily the case. Rather, only a portion of the tape may be incontact with the tape bearing surface, constantly or intermittently,with other portions of the tape riding (or “flying”) above the tapebearing surface on a layer of air, sometimes referred to as an “airbearing”. The first module 302 will be referred to as the “leading”module as it is the first module encountered by the tape in a threemodule design for tape moving in the indicated direction. The thirdmodule 306 will be referred to as the “trailing” module. The trailingmodule follows the middle module and is the last module seen by the tapein a three module design. The leading and trailing modules 302, 306 arereferred to collectively as outer modules. Also note that the outermodules 302, 306 will alternate as leading modules, depending on thedirection of travel of the tape 315.

In one embodiment, the tape bearing surfaces 308, 310, 312 of the first,second and third modules 302, 304, 306 lie on about parallel planes(which is meant to include parallel and nearly parallel planes, e.g.,between parallel and tangential as in FIG. 6), and the tape bearingsurface 310 of the second module 304 is above the tape bearing surfaces308, 312 of the first and third modules 302, 306. As described below,this has the effect of creating the desired wrap angle α₂ of the taperelative to the tape bearing surface 310 of the second module 304.

Where the tape bearing surfaces 308, 310, 312 lie along parallel ornearly parallel yet offset planes, intuitively, the tape should peel offof the tape bearing surface 308 of the leading module 302. However, thevacuum created by the skiving edge 318 of the leading module 302 hasbeen found by experimentation to be sufficient to keep the tape adheredto the tape bearing surface 308 of the leading module 302. The trailingedge 320 of the leading module 302 (the end from which the tape leavesthe leading module 302) is the approximate reference point which definesthe wrap angle α₂ over the tape bearing surface 310 of the second module304. The tape stays in close proximity to the tape bearing surface untilclose to the trailing edge 320 of the leading module 302. Accordingly,read and/or write elements 322 may be located near the trailing edges ofthe outer modules 302, 306. These embodiments are particularly adaptedfor write-read-write applications.

A benefit of this and other embodiments described herein is that,because the outer modules 302, 306 are fixed at a determined offset fromthe second module 304, the inner wrap angle α₂ is fixed when the modules302, 304, 306 are coupled together or are otherwise fixed into a head.The inner wrap angle α₂ is approximately tan⁻¹(δ/W) where δ is theheight difference between the planes of the tape bearing surfaces 308,310 and W is the width between the opposing ends of the tape bearingsurfaces 308, 310. An illustrative inner wrap angle α₂ is in a range ofabout 0.3° to about 1.1°, though can be any angle required by thedesign.

Beneficially, the inner wrap angle α₂ on the side of the module 304receiving the tape (leading edge) will be larger than the inner wrapangle α₃ on the trailing edge, as the tape 315 rides above the trailingmodule 306. This difference is generally beneficial as a smaller α₃tends to oppose what has heretofore been a steeper exiting effectivewrap angle.

Note that the tape bearing surfaces 308, 312 of the outer modules 302,306 are positioned to achieve a negative wrap angle at the trailing edge320 of the leading module 302. This is generally beneficial in helpingto reduce friction due to contact with the trailing edge 320, providedthat proper consideration is given to the location of the crowbar regionthat forms in the tape where it peels off the head. This negative wrapangle also reduces flutter and scrubbing damage to the elements on theleading module 302. Further, at the trailing module 306, the tape 315flies over the tape bearing surface 312 so there is virtually no wear onthe elements when tape is moving in this direction. Particularly, thetape 315 entrains air and so will not significantly ride on the tapebearing surface 312 of the third module 306 (some contact may occur).This is permissible, because the leading module 302 is writing while thetrailing module 306 is idle.

Writing and reading functions are performed by different modules at anygiven time. In one embodiment, the second module 304 includes aplurality of data and optional servo readers 331 and no writers. Thefirst and third modules 302, 306 include a plurality of writers 322 andno data readers, with the exception that the outer modules 302, 306 mayinclude optional servo readers. The servo readers may be used toposition the head during reading and/or writing operations. The servoreader(s) on each module are typically located towards the end of thearray of readers or writers.

By having only readers or side by side writers and servo readers in thegap between the substrate and closure, the gap length can besubstantially reduced. Typical heads have piggybacked readers andwriters, where the writer is formed above each reader. A typical gap is20-35 microns. However, irregularities on the tape may tend to droopinto the gap and create gap erosion. Thus, the smaller the gap is thebetter. The smaller gap enabled herein exhibits fewer wear relatedproblems.

In some embodiments, the second module 304 has a closure, while thefirst and third modules 302, 306 do not have a closure. Where there isno closure, preferably a hard coating is added to the module. Onepreferred coating is diamond-like carbon (DLC).

In the embodiment shown in FIG. 5, the first, second, and third modules302, 304, 306 each have a closure 332, 334, 336, which extends the tapebearing surface of the associated module, thereby effectivelypositioning the read/write elements away from the edge of the tapebearing surface. The closure 332 on the second module 304 can be aceramic closure of a type typically found on tape heads. The closures334, 336 of the first and third modules 302, 306, however, may beshorter than the closure 332 of the second module 304 as measuredparallel to a direction of tape travel over the respective module. Thisenables positioning the modules closer together. One way to produceshorter closures 334, 336 is to lap the standard ceramic closures of thesecond module 304 an additional amount. Another way is to plate ordeposit thin film closures above the elements during thin filmprocessing. For example, a thin film closure of a hard material such asSendust or nickel-iron alloy (e.g., 45/55) can be formed on the module.

With reduced-thickness ceramic or thin film closures 334, 336 or noclosures on the outer modules 302, 306, the write-to-read gap spacingcan be reduced to less than about 1 mm, e.g., about 0.75 mm, or 50% lessthan commonly-used LTO tape head spacing. The open space between themodules 302, 304, 306 can still be set to approximately 0.5 to 0.6 mm,which in some embodiments is ideal for stabilizing tape motion over thesecond module 304.

Depending on tape tension and stiffness, it may be desirable to anglethe tape bearing surfaces of the outer modules relative to the tapebearing surface of the second module. FIG. 6 illustrates an embodimentwhere the modules 302, 304, 306 are in a tangent or nearly tangent(angled) configuration. Particularly, the tape bearing surfaces of theouter modules 302, 306 are about parallel to the tape at the desiredwrap angle α₂ of the second module 304. In other words, the planes ofthe tape bearing surfaces 308, 312 of the outer modules 302, 306 areoriented at about the desired wrap angle α₂ of the tape 315 relative tothe second module 304. The tape will also pop off of the trailing module306 in this embodiment, thereby reducing wear on the elements in thetrailing module 306. These embodiments are particularly useful forwrite-read-write applications. Additional aspects of these embodimentsare similar to those given above.

Typically, the tape wrap angles may be set about midway between theembodiments shown in FIGS. 5 and 6.

FIG. 7 illustrates an embodiment where the modules 302, 304, 306 are inan overwrap configuration. Particularly, the tape bearing surfaces 308,312 of the outer modules 302, 306 are angled slightly more than the tape315 when set at the desired wrap angle α₂ relative to the second module304. In this embodiment, the tape does not pop off of the trailingmodule, allowing it to be used for writing or reading. Accordingly, theleading and middle modules can both perform reading and/or writingfunctions while the trailing module can read any just-written data.Thus, these embodiments are preferred for write-read-write,read-write-read, and write-write-read applications. In the latterembodiments, closures should be wider than the tape canopies forensuring read capability. The wider closures may require a widergap-to-gap separation. Therefore a preferred embodiment has awrite-read-write configuration, which may use shortened closures thatthus allow closer gap-to-gap separation.

Additional aspects of the embodiments shown in FIGS. 6 and 7 are similarto those given above.

A 32 channel version of a multi-module head 126 may use cables 350having leads on the same or smaller pitch as current 16 channelpiggyback LTO modules, or alternatively the connections on the modulemay be organ-keyboarded for a 50% reduction in cable span. Over-under,writing pair unshielded cables may be used for the writers, which mayhave integrated servo readers.

The outer wrap angles α₁ may be set in the drive, such as by guides ofany type known in the art, such as adjustable rollers, slides, etc. oralternatively by outriggers, which are integral to the head. Forexample, rollers having an offset axis may be used to set the wrapangles. The offset axis creates an orbital arc of rotation, allowingprecise alignment of the wrap angle α₁.

To assemble any of the embodiments described above, conventional u-beamassembly can be used. Accordingly, the mass of the resultant head may bemaintained or even reduced relative to heads of previous generations. Inother approaches, the modules may be constructed as a unitary body.Those skilled in the art, armed with the present teachings, willappreciate that other known methods of manufacturing such heads may beadapted for use in constructing such heads. Moreover, unless otherwisespecified, processes and materials of types known in the art may beadapted for use in various embodiments in conformance with the teachingsherein, as would become apparent to one skilled in the art upon readingthe present disclosure.

Actuator assemblies according to various embodiments may have multipledegrees of freedom. Such actuators may be able to selectively adjust theorientation and/or position of a magnetic head with respect to amagnetic medium during operation thereof, and thereby may be able tocompensate for various operational conditions, e.g., tape skew, tapeshifting, etc. Accordingly, actuator assembly components may generateheat as a result of electrical current being used to position theactuator assembly about multiple degrees of freedom. As components ofthe actuator assembly heat up, the resistance of the actuator coilsincrease, which may as a result take more electrical current to skew thehead to the same angular displacement than when the coils were cool.

Actuator assemblies having multiple degrees of freedom may experienceoverheating during operation. Overheating may lead to a degradation ofreadback quality and/or inhibit track following performance, and mayultimately lead to actuator failure.

Various embodiments described herein include preventative actions inresponse to determining, via one or more comparisons, that an actuatorassembly is overheating.

FIGS. 8A-8C depict an apparatus 800, in accordance with one embodiment.As an option, the present apparatus 800 may be implemented inconjunction with features from any other embodiment listed herein, suchas those described with reference to the other FIGS., such as FIGS.1A-7. However, such apparatus 800 and others presented herein may beused in various applications and/or in permutations which may or may notbe specifically described in the illustrative embodiments listed herein.Further, the apparatus 800 presented herein may be used in any desiredenvironment. Thus FIGS. 8A-8C (and the other FIGS.) may be deemed toinclude any possible permutation.

Referring now to FIGS. 8A-8C, the apparatus 800 includes a pivotassembly 802 which is coupled to a head carriage assembly 804. The pivotassembly 802 is preferably coupled to the head carriage assembly 804such that the pivot assembly 802 pivotably supports the head carriageassembly 804 and head module 812, e.g., via a pivot pin 806. The pivotpin 806 may implement a bushing-pin configuration, as would beappreciated by one skilled in the art upon reading the presentdescription.

Accordingly the head carriage assembly 804 may be able to rotate aboutan axis of skew, which is illustrated as extending through about theaxis of the pivot pin 806. Specifically, the axis of skew extendsperpendicular to a plane defined by an intended direction of mediamovement 807 across the head carriage assembly 804 and a fine motiondirection 810 of the head carriage assembly 804. The direction of finemotion (fine motion direction 810) is oriented about perpendicular tothe intended direction of media movement 807 such that a position of thehead carriage assembly 804 relative to the data tracks of a magnetictape being passed thereover may be adjusted as desired, e.g., tocompensate for shifting of the tape during operation.

Apparatus 800 additionally includes a motor 808 coupled to the headcarriage assembly 804 which may be used to rotatably position the headcarriage assembly 804 about the axis of skew. Thus, the motor 808 may beused to selectively rotate the head carriage assembly 804 about the axisof skew, thereby inducing a relative motion between the head carriageassembly 804 and the linear assembly 814 (described below). This abilityto selectively rotate the head carriage assembly 804 about the axis ofskew allows for the apparatus 800 to compensate (may herein be moregenerally referred to as “skew following”) for tape skew experiencedduring operation, e.g., while tape is being passed over the head module812. Skew following may ensure that the head remains perpendicular tothe tape to ensure proper reading and writing functions.

According to various embodiments, skew following embodiments describedherein may be particularly advantageous in tape drive actuatorapparatuses with a flangeless tape path.

It should be noted that apparatus 800 also includes a second motor 828coupled to the head carriage assembly 804 which may be used to positionthe head carriage assembly 804 in the fine motion direction 810 duringoperation, e.g., while tape is being passed over the head module 812.Accordingly, apparatus 800 includes a linear assembly 814 which isconfigured to move along the fine motion direction 810. Fine motionflexure 824 ensures that the linear assembly 814 travels in the finemotion direction 810 by restricting motion in alternate directions,e.g., along the direction of tape travel 807.

The linear assembly 814 may additionally support the pivot pin 806.Thus, the motor 808 may be used to selectively position the headcarriage assembly 804 in the fine motion direction 810 as desired.Moreover, the linear assembly 814 is preferably coupled to the headcarriage assembly 804 (e.g., via pivot pin 806) such that the linearassembly 814 carries along the head carriage assembly 804 duringmovement in the fine motion direction 810 (described in further detailbelow). Accordingly, the motor 808 may enable the apparatus 800 toperform track following in addition to skew compensation duringoperation, preferably such that tape shifting may be overcome whilereading from and/or writing to tape being passed over the head module812.

According to an example, which is in no way intended to limit theinvention, the motors 808, 828 may preferably be electromagnetic motors,e.g., such as Lorentz force motors, voice coil motors, etc. As will beappreciated by one skilled in the art upon reading the description,movement may be induced upon applying an electrical current to each ofthe coils 805 of the electromagnetic motor. Thus, appropriate selectionof the current to apply to each of the coils 805 of the electromagneticmotors 808, 828 may induce a movement of the head carriage assembly 804about the axis of skew, e.g., for positioning the head carriage assemblyrelative to the intended direction of media movement 807. Moreover,appropriate selection of the current to apply to each of the coils 805may induce a movement of the head carriage assembly 804 in the finemotion direction 810, e.g., for track following. It follows that theapparatus 800 may be selectively positioned both in the fine motiondirection 810 and about the axis of skew.

Looking to the embodiment illustrated in FIGS. 8A-8C, the motors 808,828 include two independently operable coils 805. The coils 805 arepositioned relative to field generators 822 such that the forcegenerated by currents passing through the coils 805 when energizedcontrols the position of the assembly, as would be appreciated by oneskilled in the art upon reading the present description. Theillustrative field generators 822 shown have a plurality of hard magnets823. As a result, the coils 805 of motors 808, 828 are capable ofinducing movement in a common direction and/or in opposite directions bycontrolling the direction and magnitude of the current through each ofthe coils 805.

By using the coils 805 to induce movement in a common direction, themotor 808, 828 is able to cause the head carriage assembly 804 totranslate linearly along the fine motion direction 810. Similarly, byusing the coils 805 to induce movement in a single direction but inunequal amounts, or in opposite (e.g., antiparallel) directions, themotors 808, 828 are able to cause a rotation of the head carriageassembly 804 about the axis of rotation, e.g., at the pivot pin 806.Accordingly, current(s) may be applied to the coils 805 of motors 808,828 in different combinations, in terms of magnitude and/or direction,to induce different movements of the head carriage assembly 804 and/orlinear assembly 814.

It should be noted that although the motors 808, 828 are depicted in thepresent embodiment as being used to enable selective movement of thehead carriage assembly 804 in the fine motion direction 810 as well asrotatably position the head carriage assembly 804 about the axis ofskew, different types of motor configurations may be used to enable therespective movement in different embodiments. For example, according toalternative approaches, a single motor may be used to selectively movethe head carriage assembly 804 in the fine motion direction 810 andadditionally may be used to rotatably position the head carriageassembly 804 about the axis of skew.

Referring still to FIGS. 8A-8C, the linear assembly 814 is illustratedin the present embodiment as supporting the pivot assembly 802 and thehead carriage assembly 804, e.g., by being coupled thereto via pivot pin806 extending therebetween. Thus, as the linear assembly 814 moves alongthe fine motion direction 810, the pivot assembly 802 and the headcarriage assembly 804 move as well. As previously mentioned, the linearassembly 814, the pivot assembly 802 and the head carriage assembly 804effectively move as a single piece in the fine motion direction 810.

Additionally, first and second flexures 816, 818 extend between the headcarriage assembly 804 and the linear assembly 814. Flexures 816, 818 asseen in FIGS. 8A-8C, or in accordance with any of the other embodimentsdescribed and/or suggested herein, are included to prevent anundesirable pitching motion from occurring during reading from and/orwriting to a tape which may be traveling over the head module 812.Pitching motion occurs when at least a portion of the apparatus moves ina pivoting fashion about an axis of the apparatus oriented alongdirection 807.

Pitching may occur as a result of the pivot pin 806 serving as the onlycomponent coupling the head carriage assembly 804 and the remainder ofthe apparatus 800, e.g., the linear assembly 814. Various attempts toredesign the pivot pin 806 itself to overcome this pitching motionproved to be unrealistic, e.g., due to spatial constraints in theapparatus 800. However, by implementing the flexures 816, 818 asdisclosed herein, the pitching motion, which again is undesirable forhead track following performance, is attenuated, as will be described infurther detail below. As a result, the bandwidth potential of theapparatus 800 is increased, because of the resulting better trackfollowing performance achieved when pitching is attenuated.

The longitudinal axes 820 of the flexures 816, 818 extend from the headcarriage assembly 804 to the linear assembly 814 in a directiongenerally parallel to the axis of skew, e.g., within about 15 degreesfrom being parallel with the axis of skew. First ends of the flexures816, 818 are preferably coupled to the head carriage assembly 804 whilesecond ends of the flexures 816, 818 are coupled to the linear assembly814. It should be noted that the term “ends” is in no way intended tolimit the invention. According to alternate approaches, portions of thefirst and/or second flexures 816, 818 may extend beyond the points ofcontact with the head carriage assembly 804 and/or the linear assembly814, e.g., depending on available space. Moreover, although the flexures816, 818 are illustrated in the present embodiment as being coupled tothe head carriage assembly 804 and the linear assembly 814 using bolts826, the flexures 816, 818 may be coupled to the head carriage assembly804 and/or the linear assembly 814 using any of the approaches describedbelow.

As described above, it is preferred that the motor 808 is able torotatably position the head carriage assembly 804 about the axis ofskew. Thus, although the head carriage assembly 804 and the linearassembly 814 are coupled together by the flexures 816, 818, the abilityto selectively rotate the head carriage assembly 804 about the axis ofskew is preserved. Accordingly, the flexures 816, 818 are preferablyable to permit the rotatable positioning of the head carriage assembly804 about the axis of skew.

With continued reference to FIGS. 8A-8C, heat may be generated, e.g., inthe coils 805, in and/or around apparatus 800, in motors 808, 828, etc.,as electrical current is passed through the coils 805 of theelectromagnetic motors 808, 828.

As noted above, the temperature of the coil may exceed a safe operatinglimit, e.g., as when in use in a warm environment, when higher thannormal amounts of current are being passed through the coil, etc.Overheating may result in degradation, failure to properly track-follow,etc. Various embodiments estimate the state of the coil bulk temperatureby using the servo system to measure the skew functional gain andcompare the instantaneous skew functional gain to a reference gain, andtake some action in response thereto, such as stopping the system toprevent failure. The skew functional gain changes with changes in thecoil resistance due to increased coil temperature. Accordingly, therelationship between the current passing through the coils and thecorresponding temperature can be mapped.

Generally, with an actuator system described herein, the primaryfunction is to track follow and then enable the skew following function.It is necessary to track follow during operation of the drive, but it ispossible to temporarily disable or override the skew following function.It may not be generally feasible to perform the skew following functionwithout the track following function, and therefore the ability toseparately use the skew following function allows for the coiltemperature to be estimated in some approaches.

In various embodiments, the coil electrical circuits used to operate thecoils may supply a constant amount of current when commanded to operateat any commanded level regardless of the coil resistance. In otherwords, the electrical current supply circuit may adjust the supplyvoltage to ensure that the current passing through the coil is at thecommanded level from the servo system.

It should be noted that if the ability to know the resistance across thecoil terminals was present, the coil temperature could be more easilyestimated, but this scheme would require extra circuitry. Variousembodiments do not have such extra circuitry, but rather estimate thebulk coil temperature without knowledge of the coil resistance. The bulkcoil temperature may be an average temperature, but it should beunderstood that some windings in the coil pack can be hotter and somecan be cooler, so when establishing margins this should be taken intoaccount.

The estimation of the coil temperature may use a relationship betweentemperature of the coil and current passing through the coil. Thisrelationship may be determined outside the tape drive and prior to fielduse of the tape drive and/or tape actuator.

The relationship between temperature of the coil and current passingthrough the coil may include a correlation mapping the increase in coiltemperature corresponding to an increase in current passing through thecoils. As previously described, the resistance of the actuator coils mayincrease as a result of heating up during operation. This increase inresistance may in turn causes the system to apply more electricalcurrent to skew the head to the same angular displacement than when thecoils were cool.

An example of an established relationship between temperature of thecoil and current passing through the coil is shown in FIG. 9.

FIG. 9 depicts a comparative plot 900, in accordance with oneembodiment. As an option, the present comparative plot 900 may beimplemented in conjunction with features from any other embodimentlisted herein, such as those described with reference to the otherFIGS., such as FIGS. 1A-8C. However, such comparative plot 900 andothers presented herein may be used in various applications and/or inpermutations which may or may not be specifically described in theillustrative embodiments listed herein. Further, the comparative plot900 presented herein may be used in any desired environment. Thus FIG. 9(and the other FIGS.) may be deemed to include any possible permutation.

FIG. 9 is an illustrative coil temperature (° C.) versus current (Ampsof direct current “DC”) comparative plot 900. Plot 900 includes plotpoints 904, which provide reference data of how specific coiltemperatures correlate with specific currents being applied to the coils805, in this example. Such data may be obtained via experimentation withthe subject drive at known operating parameters, ideally parameters thatthe drive is expected to encounter in use.

A linear regression, represented by line 902, may provide a best fitlinear correlation of the plot points 904 for reference. According tovarious embodiments, the linear equation derived from the data in plot900 may be used to calculate an estimation of the temperature of thecoil 805 for any current level passing through the coil 805. In thisexample, the illustrative linear regression line 902 in plot 900 maycorrespond to a linear equation of: Coil Temperature=333.79*CurrentAmps+21.304.

A relationship between coil resistance and temperature may be determinedusing the established properties for the type of conductor used in thecoil, generally available in materials books. Referring to FIG. 10, anillustrative comparison of the relationship between the resistance ofthe coils and the corresponding temperature of the coils is shown.

FIG. 10 depicts a comparative plot 1000, in accordance with oneembodiment. As an option, the present comparative plot 1000 may beimplemented in conjunction with features from any other embodimentlisted herein, such as those described with reference to the otherFIGS., such as FIGS. 1A-8C. However, such comparative plot 1000 andothers presented herein may be used in various applications and/or inpermutations which may or may not be specifically described in theillustrative embodiments listed herein. Further, the comparative plot1000 presented herein may be used in any desired environment. Thus FIG.10 (and the other FIGS.) may be deemed to include any possiblepermutation.

FIG. 10 is an illustrative coil temperature versus coil resistancecomparative plot 1000. Plot 1000 includes plot points 1004, which mayprovide reference data of how specific coil temperatures correlate withcoil resistances values that are determined based on one or moreproperties of the conductor of the coil, e.g., wire properties. Linearregression line 1002 may correspond to an equation for establishing coiltemperature versus coil resistance relationships. In this specificexample, the linear regression line 1002 in plot 1000 has a linearequation of: Coil Temperature=17.095*Coil Resistance−234.38.

It should be noted that the “Coil Resistance” usable to generate thelinear equation and/or of various embodiments described herein, may bedetermined based on one or more wire properties, rather than determinedbased on one or more measurements of the actual coil resistance.According to various embodiments, no circuitry to determine a resistanceacross the coil may be present in the controller and/or anywhere else inthe apparatus 800. Accordingly, an individual and/or a bulk coiltemperature, e.g. “Coil Temperature” of FIG. 10, may be determinedwithout using a coil resistance value and/or derivative thereof.

The correlations and/or calculated values described herein, particularlywith reference to those represented by FIGS. 9 and 10, may be calculatedonly one time for a given drive, and in a production environment, onetime for the particular actuator design. For example, because highvolume production of actuator system parts generally leads to actuatorshaving substantially similar designs and/or performances, therelationships described in FIGS. 9-10 may be established once andapplied to all actuators of the same type.

Illustrative parameters of the coils that may be used to determine theserelationships include, e.g., the outer diameter of the coil, the packingdimensions of the coil, the length of wire of the coil, etc.

It should be noted that coil temperature versus coil resistance behaviormay vary depending on the embodiment and/or the coil design.Accordingly, correlations and/or calculated values described herein maybe calculated more than one time, e.g., calculated for each differingcoil design, calculated for every individual apparatus 800, calculatedat the discretion of a user, etc.

In addition to the relationships established in FIGS. 9-10, a storedreference gain (may herein be referred to as “G_ref”) may be establishedfor one or more components of the actuator system. The relationshipsestablished in FIGS. 9-10 and the stored G_ref may provide one or morereference thermal relationships and/or values that may be compared tothe one or more thermal relationships and/or values of the actuatordetermined during operation, e.g., to take some action such as toprevent temperature damage of a tape drive actuator, as will bedescribed elsewhere herein.

Calculations of the G_ref values may be performed by operating the skewfollowing function of the apparatus to various skew reference valuesduring operation of the tape drive system, e.g. system 100, in acontrolled environment. G_ref values may be stored, e.g., on the mainlogic card memory as a permanent or modifiable setting, on a sub-logiccard, on any storage device of a type known in the art, etc.

In calculating the G_ref value, the reference values may be stepped fromnegative values to positive values for illustrative purposes (see FIG.11), rather than just setting a reference value to “0”. Stepping thereference values through negative values to positive values provides aG_ref of the electromagnetic motor that enables the skew function of theactuator assembly.

Referring to FIG. 11, an example of determining the G_ref value will nowbe detailed below.

FIG. 11 depicts a comparative plot 1100, in accordance with oneembodiment. As an option, the present comparative plot 1100 may beimplemented in conjunction with features from any other embodimentlisted herein, such as those described with reference to the otherFIGS., such as FIGS. 1A-8C. However, such comparative plot 1100 andothers presented herein may be used in various applications and/or inpermutations which may or may not be specifically described in theillustrative embodiments listed herein. Further, the comparative plot1100 presented herein may be used in any desired environment. Thus FIG.11 (and the other FIGS.) may be deemed to include any possiblepermutation.

FIG. 11 is an illustrative average skew DAC output versus commanded skewreference comparative plot 1100. Plot 1100 includes plot points 1104,which may provide reference data of how specific average skew DACoutputs correlate with specific commanded skews. Line 1102 may provide alinear correlation of the plot points 1104 for reference.

The determined G_ref value may establish a reference gain, e.g., a ratioof the output current (amps) to the skew reference angle (radians). Inthe example shown, the G_ref value of plot 1100 was determined usinglinear algebra to be about 21.453 digitized amps per digitized radians.

When the coils warm, as can occur during operation of the tape drive,additional skew gain measurements may be made to determine the skew gain(G_test). This can be done, for example at turn around at the end oftape, or actual operation, when the skew reference values used arewithin the drive operational specifications. By commanding the skewfollowing system to operate at a non-zero reference value and byrecording the current driven to the coils, which may be known by theservo system at any time, a best fit, or average slope for eachmeasurement point may then be calculated to establish a skew gain (mayherein be referred to as “G_test”) value. Known mathematical techniquesmay be used.

The G_test value may be compared to the G_ref value to ensure that oneor more components, e.g., the coils, of the tape drive are not operatingat dangerous temperatures. A preferred method which includes thecalculation of the G_test value and the comparison between the storedG_ref value and the calculated G_test value will now be described below.

FIG. 12 shows a method 1200 for preventing temperature damage of a tapedrive actuator, in accordance with one embodiment. As an option, thepresent method 1200 may be implemented to prevent temperature damage ofa tape drive actuator such as those shown in the other FIGS. describedherein. Of course, however, this method 1200 and others presented hereinmay be used to form structures for a wide variety of devices and/orpurposes, provide applications which may or may not be related to theillustrative embodiments listed herein. Further, the methods presentedherein may be carried out in any desired environment. Moreover, more orless operations than those shown in FIG. 12 may be included in method1200, according to various embodiments. It should also be noted that anyof the aforementioned features may be used in any of the embodimentsdescribed in accordance with the various methods.

Operation 1202 includes determining the G_test of a coil, orequivalently, a plurality of coils, using skew information from a servosubsystem. The G_test may be compared to a stored reference value todetermine if the servo system is operating at a safe/non-damagingtemperature, as will be described elsewhere herein.

According to various embodiments, G_test may be determined prior tooperation of the coil.

According to further embodiments, G_test may be determined after aperiod of operation of the coil. For example, G_test may be determinedby recording the current being driven to the coils after the skewfollowing system is commanded to operate at a non-zero reference value.The G_test value may be determined based on the current driven to thecoils in real time by acquiring the current level from the servo system.

Referring momentarily to FIG. 13, an example of determining the G_testvalue while the actuator coils are warm, e.g., during operation of thetape drive, will now be detailed.

FIG. 13 depicts a comparative plot 1300, in accordance with oneembodiment. As an option, the present comparative plot 1300 may beimplemented in conjunction with features from any other embodimentlisted herein, such as those described with reference to the otherFIGS., such as FIGS. 1A-8C. However, such comparative plot 1300 andothers presented herein may be used in various applications and/or inpermutations which may or may not be specifically described in theillustrative embodiments listed herein. Further, the comparative plot1300 presented herein may be used in any desired environment. Thus FIG.13 (and the other FIGS.) may be deemed to include any possiblepermutation.

FIG. 13 is an illustrative average skew DAC output versus commanded skewreference comparative plot 1300. Plot 1300 includes measurement points(may be herein referred to as “plot points 1304”), which providereference data of how specific average skew DAC outputs correlate withspecific commanded skews. This correlation may be dependent upon thesupply voltage supplied by the electrical current supply circuit as itattempts to ensure that the current passing through wire of the coils isa commanded level, e.g., as commanded by the servo system to compensatefor tape skew.

Line 1302 provides a representative linear correlation of the plotpoints 1304 for reference. As described above, by commanding the skewfollowing system to operate at a non-zero reference value and byrecording the current driven to the coils, which current level is knownby the servo system at any time, a best fit, or average slope for eachplot point 1304 may then be calculated to establish the G_test value.

According to various embodiments, the G_test value may be determinedinstantaneously. For example, the G_test value may be instantaneouslydetermined during read or write function of the tape drive, e.g. withoutstopping the tape. According to further embodiments, the G_test valuemay be determined by averaging any number of plot points 1304 over aperiod of time that is greater than instantaneously, e.g. by stoppingthe tape drive functionality more than one time, and calculating theG_test.

For purposes of an example, the G_test value of plot 1300 was determinedto be 21.8842 digitized amps per digitized radians.

Referring again to FIG. 12, operation 1204 of method 1200 includescomparing the G_test to the stored G_ref. Comparing the G_test to thestored G_ref may be performed to determine if the components of theactuator system, e.g. the coils of apparatus 800, are operating at adangerous and/or damaging temperature.

According to further embodiments, the G_test may be compared to thestored G_ref for determining whether a temperature of the coil iselevated, e.g., above a predefined safe operating temperature, somepredefined threshold, etc.

Comparing the G_test to the stored G_ref may be performed using, e.g., asimple comparison, generation of a ratio, a comparative method known inthe art, etc.

It may be observed that at the warm coil condition, e.g. duringoperation of the tape drive, the G_test value (G_test=22.239 in thisexample) is higher than the stored G_ref value (G_ref=21.453) which wasdetermined and stored in the cool condition, e.g. before operationand/or assembly of apparatus 800. This is due to the actuator system,e.g., the coils 805 of apparatus 800, needing more current to achievethe same angular motion during warm conditions, than would be neededduring cool conditions. This may be due to an increase in the resistanceof the coil pack. The increase in the resistance of the coil pack mayoccur in response to the coil pack being warmer than when G_ref wascalculated.

The G_test and G_ref values (determined above) may then be compared tocalculate the ratio of G_test/G_ref, or 22.239/21.453=1.0366. This ratiomay represent an approximately 3.7% increase in the coil resistance andmay furthermore represent a proportional increase in the coiltemperature. In embodiments where no circuitry is used to determine aresistance across the coil, and such circuitry may not even be presentin the controller and/or anywhere else in the apparatus 800, thisdetermination is made without using knowledge of the exact instantaneousresistance of the coil itself. The reference resistance and temperaturemay then be utilized in making a determination that the bulk coiltemperature is acceptable or not.

Operation 1206 includes taking an action in response to the comparing ofthe test skew gain to the reference gain. For example, criteria can beset for gain changes that are above a threshold or in some predefinedrange in order to protect the coil.

In some embodiments, when the G_test value is found, e.g., based on thecomparison performed in operation 1204, to be a determined amountsmaller than or equal to the G_ref value, an action may be performed,e.g. additional comparisons of G_test and G_ref values may be performedafter a predetermined amount of time, the operating currents may bestored as safe operational currents for the coils of apparatus 800 onthe main logic card memory, a non-altering functional action of a typeknown in the art, etc. Non-altering functional actions of operation 1206may preferably be performed in response to the servo system, e.g.,apparatus 800, being determined to be operating at a safe and/ornon-damaging temperature.

In some embodiments, when the G_test value is found, e.g., based on thecomparison performed in operation 1204, to be a determined amountgreater than the G_ref value, an action may be performed, e.g. the datastorage device may be stopped; the operating current, e.g. the currentpassing through coils 805, may be decreased to a stored safe operatingcurrent; a cooling action may be initiated; etc. Actions taken inresponse to determining that the G_test value is a determined amountgreater than the G_ref value, may decrease the temperatures of the coilsand/or one or more other heated components in the actuator system.

The G_test value being at least a determined amount greater than theG_ref value may correlate to the servo system, e.g., apparatus 800and/or the entire data storage device operating at a damaging currentlevel and/or damaging temperature level, e.g., a current and/ortemperature level that would permanently physically deform the generalpack shape of the coils 805; a current and/or temperature level thatwould cause rubbing and/or friction in stationary components, e.g., theface of a magnet within the actuator assembly; a current and/ortemperature level that would soften the insulation and/or coil adhesivesof apparatus 800; being in danger of some other thermal damage ordegradation; etc.

Further operations may include calculating an estimated temperature ofthe coil. The estimated temperature of the coil may be calculated byestimating the coil resistance and correlating the resistance to atemperature. According to various embodiments, no circuitry to determinean actual resistance across the coil may be present in the controllerand/or anywhere else in the apparatus 800. Accordingly, the estimatedtemperature of the coil is determined without using a coil resistancevalue and/or derivative thereof.

An example of estimating the temperature of the coil will now bedescribed by the below.

It should be noted that the example below includes illustrative valuesof the plots and/or examples described above. Accordingly, calculationsof the present example may be performed with calibration being conductedunder controlled environmental conditions.

With a G_ref value determined with a coil temperature of 20° C., usingthe relationship between a skew gain change correlating to a change inthe resistance of the coils, plot 1000 of FIG. 10 may be used tocalculate an estimated resistance value of 14.88 ohms when the coiltemperature is at 20° C. The warm coil resistance may then be calculatedby multiplying the estimated resistance value when the coil temperatureis at 20° C. with the G_test/G_ref ratio value, to be 1.0366*14.88ohms=15.425 ohms.

Using the linear equation of FIG. 10, and the estimated resistancevalue, an estimated temperature of the coil may be calculated to be:Estimated Coil Temperature=17.095*15.425−234.38≈29.31° C. A 29.31° C.estimated coil temperature may equate to about a 9.3 degree increase inthe coil temperature relative to the temperature when G_ref wasdetermined.

The estimated temperature may preferably be compared to a predeterminedthreshold to determine if the estimated temperature is above thethreshold. If the estimated temperature is determined to be greater thanthe threshold, e.g., the coils of the actuator are operating at too highof a temperature, an action may be performed which may include stoppingthe data storage device.

Alternatively, if the estimated temperature is determined to be lessthan or equal to a determined threshold, e.g., the coils of the actuatorare operating at an acceptable temperature, a non-altering action may beperformed. For example, in response to determining that the estimatedtemperature is less than or equal to a determined threshold, theestimated temperature may again be recalculated at a future time, e.g.,after a subsequent period of apparatus 800 operation.

An estimated coil temperature and/or the corresponding increase and/ordecrease in the coil temperature may be evaluated, e.g., via establishedcomparisons, to determine if actions should be performed. For example,an action may include shutting down the actuator system to cool thecoils, when it is determined that estimated coil temperature is toohigh.

Because design components of the apparatus, e.g., the magnets, thedriving circuitry, apparatus components of a type known in the art mayremain substantially unchanged, the change in the operational skew gainvalue may be due to increases or decreases in the resistance of the coilwire. Accordingly, the increase in the resistance of the wire may be dueto an increase in the coil bulk temperature. Accordingly, by measuringG_test at predefined intervals of tape drive functionality, andcomparing the measurement to G_ref measured under controlledenvironmental conditions, the change in the skew gain may vary dependingon the coil bulk temperature. According to various embodiments, thisbehavior can be used to monitor the bulk coil temperature, andfurthermore perform an action upon determining that the bulk coiltemperature is undesirable and/or damages design functionally.

U.S. Pat. No. 8,035,926, which discloses an exemplary tape storagesystem that can be modified to operate as described herein, isincorporated by reference

The present invention may be a system, a method, and/or a computerprogram product. The computer program product may include a computerreadable storage medium (or media) having computer readable programinstructions thereon for causing a processor to carry out aspects of thepresent invention.

The computer readable storage medium can be a tangible device that canretain and store instructions for use by an instruction executiondevice. The computer readable storage medium may be, for example, but isnot limited to, an electronic storage device, a magnetic storage device,an optical storage device, an electromagnetic storage device, asemiconductor storage device, or any suitable combination of theforegoing. A non-exhaustive list of more specific examples of thecomputer readable storage medium includes the following: a portablecomputer diskette, a hard disk, a random access memory (RAM), aread-only memory (ROM), an erasable programmable read-only memory (EPROMor Flash memory), a static random access memory (SRAM), a portablecompact disc read-only memory (CD-ROM), a digital versatile disk (DVD),a memory stick, a floppy disk, a mechanically encoded device such aspunch-cards or raised structures in a groove having instructionsrecorded thereon, and any suitable combination of the foregoing. Acomputer readable storage medium, as used herein, is not to be construedas being transitory signals per se, such as radio waves or other freelypropagating electromagnetic waves, electromagnetic waves propagatingthrough a waveguide or other transmission media (e.g., light pulsespassing through a fiber-optic cable), or electrical signals transmittedthrough a wire.

Computer readable program instructions described herein can bedownloaded to respective computing/processing devices from a computerreadable storage medium or to an external computer or external storagedevice via a network, for example, the Internet, a local area network, awide area network and/or a wireless network. The network may comprisecopper transmission cables, optical transmission fibers, wirelesstransmission, routers, firewalls, switches, gateway computers and/oredge servers. A network adapter card or network interface in eachcomputing/processing device receives computer readable programinstructions from the network and forwards the computer readable programinstructions for storage in a computer readable storage medium withinthe respective computing/processing device.

Computer readable program instructions for carrying out operations ofthe present invention may be assembler instructions,instruction-set-architecture (ISA) instructions, machine instructions,machine dependent instructions, microcode, firmware instructions,state-setting data, or either source code or object code written in anycombination of one or more programming languages, including an objectoriented programming language such as Smalltalk, C++ or the like, andconventional procedural programming languages, such as the “C”programming language or similar programming languages. The computerreadable program instructions may execute entirely on the user'scomputer, partly on the user's computer, as a stand-alone softwarepackage, partly on the user's computer and partly on a remote computeror entirely on the remote computer or server. In the latter scenario,the remote computer may be connected to the user's computer through anytype of network, including a local area network (LAN) or a wide areanetwork (WAN), or the connection may be made to an external computer(for example, through the Internet using an Internet Service Provider).In some embodiments, electronic circuitry including, for example,programmable logic circuitry, field-programmable gate arrays (FPGA), orprogrammable logic arrays (PLA) may execute the computer readableprogram instructions by utilizing state information of the computerreadable program instructions to personalize the electronic circuitry,in order to perform aspects of the present invention.

Aspects of the present invention are described herein with reference toflowchart illustrations and/or block diagrams of methods, apparatus(systems), and computer program products according to embodiments of theinvention. It will be understood that each block of the flowchartillustrations and/or block diagrams, and combinations of blocks in theflowchart illustrations and/or block diagrams, can be implemented bycomputer readable program instructions.

These computer readable program instructions may be provided to aprocessor of a general purpose computer, special purpose computer, orother programmable data processing apparatus to produce a machine, suchthat the instructions, which execute via the processor of the computeror other programmable data processing apparatus, create means forimplementing the functions/acts specified in the flowchart and/or blockdiagram block or blocks. These computer readable program instructionsmay also be stored in a computer readable storage medium that can directa computer, a programmable data processing apparatus, and/or otherdevices to function in a particular manner, such that the computerreadable storage medium having instructions stored therein comprises anarticle of manufacture including instructions which implement aspects ofthe function/act specified in the flowchart and/or block diagram blockor blocks.

The computer readable program instructions may also be loaded onto acomputer, other programmable data processing apparatus, or other deviceto cause a series of operational steps to be performed on the computer,other programmable apparatus or other device to produce a computerimplemented process, such that the instructions which execute on thecomputer, other programmable apparatus, or other device implement thefunctions/acts specified in the flowchart and/or block diagram block orblocks.

The flowchart and block diagrams in the Figures illustrate thearchitecture, functionality, and operation of possible implementationsof systems, methods, and computer program products according to variousembodiments of the present invention. In this regard, each block in theflowchart or block diagrams may represent a module, segment, or portionof instructions, which comprises one or more executable instructions forimplementing the specified logical function(s). In some alternativeimplementations, the functions noted in the block may occur out of theorder noted in the figures. For example, two blocks shown in successionmay, in fact, be executed substantially concurrently, or the blocks maysometimes be executed in the reverse order, depending upon thefunctionality involved. It will also be noted that each block of theblock diagrams and/or flowchart illustration, and combinations of blocksin the block diagrams and/or flowchart illustration, can be implementedby special purpose hardware-based systems that perform the specifiedfunctions or acts or carry out combinations of special purpose hardwareand computer instructions.

Moreover, a system according to various embodiments may include aprocessor and logic integrated with and/or executable by the processor,the logic being configured to perform one or more of the process stepsrecited herein. By integrated with, what is meant is that the processorhas logic embedded therewith as hardware logic, such as an applicationspecific integrated circuit (ASIC), a field programmable gate array(FPGA), etc. By executable by the processor, what is meant is that thelogic is hardware logic; software logic such as firmware, part of anoperating system, part of an application program; etc., or somecombination of hardware and software logic that is accessible by theprocessor and configured to cause the processor to perform somefunctionality upon execution by the processor. Software logic may bestored on local and/or remote memory of any memory type, as known in theart. Any processor known in the art may be used, such as a softwareprocessor module and/or a hardware processor such as an ASIC, a FPGA, acentral processing unit (CPU), an integrated circuit (IC), etc.

It will be clear that the various features of the foregoing systemsand/or methodologies may be combined in any way, creating a plurality ofcombinations from the descriptions presented above.

It will be further appreciated that embodiments of the present inventionmay be provided in the form of a service deployed on behalf of acustomer.

The inventive concepts disclosed herein have been presented by way ofexample to illustrate the myriad features thereof in a plurality ofillustrative scenarios, embodiments, and/or implementations. It shouldbe appreciated that the concepts generally disclosed are to beconsidered as modular, and may be implemented in any combination,permutation, or synthesis thereof. In addition, any modification,alteration, or equivalent of the presently disclosed features,functions, and concepts that would be appreciated by a person havingordinary skill in the art upon reading the instant descriptions shouldalso be considered within the scope of this disclosure.

While various embodiments have been described above, it should beunderstood that they have been presented by way of example only, and notlimitation. Thus, the breadth and scope of an embodiment of the presentinvention should not be limited by any of the above-described exemplaryembodiments, but should be defined only in accordance with the followingclaims and their equivalents.

What is claimed is:
 1. A computer program product, the computer programproduct comprising a computer readable storage medium having programinstructions embodied therewith, the program instructions executable bya controller of a data storage device to cause the controller to performa method comprising: determining, by the controller, a test skew gain ofa coil using skew information from a servo subsystem of the controller;comparing, by the controller, the test skew gain to a stored referencegain for determining whether a temperature of the coil is elevated; andstopping the data storage device, by the controller, in response to thecomparing of the test skew gain to the reference gain indicating thatthe temperature of the coil is elevated.
 2. The computer program productas recited in claim 1, comprising program instructions executable by thecontroller to cause the controller to calculate an estimated temperatureof the coil.
 3. The computer program product as recited in claim 2,wherein the estimated temperature of the coil is calculated withoutusing a coil resistance value and/or derivative thereof.
 4. The computerprogram product as recited in claim 1, wherein no circuitry to determinea resistance across the coil is present in the controller.
 5. Thecomputer program product as recited in claim 1, comprising programinstructions executable by the controller to cause the controller todetermine the test skew gain prior to operation of the coil.
 6. Thecomputer program product as recited in claim 1, comprising programinstructions executable by the controller to cause the controller todetermine the test skew gain after a period of operation of the coil. 7.The computer program product as recited in claim 1, wherein the testskew gain is determined instantaneously.
 8. The computer program productas recited in claim 1, comprising program instructions executable by thecontroller to cause the controller to calculate an estimated coilresistance of the coil.
 9. The computer program product as recited inclaim 1, wherein the data storage device is a tape drive.
 10. Anapparatus, comprising: a controller configured to: determine, by thecontroller, a test skew gain of a coil of a data storage device usingskew information from a servo subsystem thereof; compare, by thecontroller, the test skew gain to a stored reference gain fordetermining whether a temperature of the coil is elevated; and stoppingthe data storage device, by the controller, in response to the comparingof the test skew gain to the reference gain indicating that thetemperature of the coil is elevated.
 11. The apparatus as recited inclaim 10, comprising: a drive mechanism for passing a magnetic mediumover a magnetic head, the magnetic head having at least one servo readercoupled to the servo subsystem.
 12. A method, comprising: determining atest skew gain of a coil in a data storage device using skew informationfrom a servo subsystem of a controller; comparing the test skew gain toa stored reference gain; and taking an action in response to thecomparing of the test skew gain to the reference gain.
 13. The method asrecited in claim 12, comprising calculating an estimated temperature ofthe coil.
 14. The method as recited in claim 13, wherein the estimatedtemperature of the coil is calculated without using a coil resistancevalue and/or derivative thereof.
 15. The method as recited in claim 12,wherein no circuitry to determine a resistance across the coil is usedto perform in the method.
 16. The method as recited in claim 12, whereinthe action includes stopping the data storage device.
 17. The method asrecited in claim 12, wherein the test skew gain is determined prior tooperation of the coil.
 18. The method as recited in claim 12, whereinthe test skew gain is determined after a period of operation of thecoil.
 19. The method as recited in claim 12, comprising calculating anestimated coil resistance of the coil.
 20. The method as recited inclaim 12, wherein the test skew gain is determined instantaneously.